HS Code:
The Dual-in-line package (DIP) category, often classified under HS Code 8542.31 (integrated circuits and microassemblies), refers to a type of electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. DIPs are widely used in integrated circuits (ICs) for various applications including microcontrollers, memory chips, and other electronic devices. They are fundamental in the electronics industry for prototyping and manufacturing due to their ease of use and compatibility with breadboards.
Total Trade Volume
USD 85 billion
Data from 2022
Source
United Nations Comtrade Database
Average Rate
4.5%
Highest Rate
12% (applied by certain developing countries)
Lowest Rate
0% (under free trade agreements such as USMCA and EU-Japan EPA)
Shift towards miniaturization
Demand for traditional DIPs is declining in favor of surface-mount technology (SMT) packages, though DIPs remain relevant for educational and hobbyist markets.
2022
Increased demand for ICs in IoT devices
Growing need for DIP components in prototyping IoT solutions, especially in developing regions with cost-sensitive markets.
2021
Supply chain disruptions
Global semiconductor shortages have affected DIP availability, pushing prices up and encouraging localized production.
2021-2022
Escalating tariffs and export controls on semiconductor technology between the US and China have disrupted the DIP supply chain, impacting global trade flows.
October 2022
Increased costs for manufacturers and potential delays in product development.
The European Union introduced the Chips Act to boost domestic semiconductor production, including components like DIPs, aiming for strategic autonomy.
February 2023
Potential increase in European production capacity and reduced reliance on Asian imports.
Taiwan announced significant investments in semiconductor research and development, focusing on advanced packaging technologies that could influence DIP designs.
June 2023
Likely to strengthen Taiwan's position in the global market and drive innovation in DIP applications.