HS Code:
Silicon carbide (SiC) wafers, doped, fall under HS Code 381800. These are semiconductor substrates used primarily in the production of high-power and high-frequency electronic devices. SiC wafers are known for their superior thermal conductivity, high electric field breakdown strength, and ability to operate at higher temperatures compared to traditional silicon wafers. They are critical in applications such as electric vehicles (EVs), renewable energy systems, and 5G technology. The doping process enhances their electrical conductivity by introducing specific impurities, tailoring them for specific semiconductor applications.
Total Trade Volume
USD 1.2 billion
Data from 2022
Source
United Nations Comtrade Database
USD 450 million
37.5% of total trade of total trade
Increasing
USD 300 million
25.0% of total trade of total trade
Stable
USD 150 million
12.5% of total trade of total trade
Increasing
USD 120 million
10.0% of total trade of total trade
Increasing
USD 80 million
6.7% of total trade of total trade
Stable
Average Rate
5.2%
Highest Rate
12% (imposed by certain developing countries)
Lowest Rate
0% (under free trade agreements like USMCA and EU-Japan EPA)
Rising demand for electric vehicles (EVs)
Increased need for SiC wafers in power electronics for EV batteries and inverters, driving trade volume growth by 15% annually.
2021-2023
Expansion of renewable energy infrastructure
SiC wafers are critical for high-efficiency solar inverters and wind power systems, boosting demand in markets like Europe and China.
2020-2022
Advancements in 5G technology
Growing use of SiC wafers in high-frequency RF devices for 5G base stations, contributing to a 10% rise in trade in Asia-Pacific.
2021-2023
The US government announced a USD 2 billion investment under the CHIPS Act to boost domestic production of SiC wafers, aiming to reduce reliance on imports.
August 2023
Likely to shift trade patterns by increasing US export capacity and reducing import dependency over the next 5 years.
China implemented tighter export controls on critical semiconductor materials, including SiC wafers, citing national security concerns.
July 2023
Potential supply chain disruptions for countries reliant on Chinese exports, pushing buyers to diversify sourcing.
The EU and Japan signed a strategic partnership to collaborate on advanced semiconductor materials, including SiC wafers, with tariff reductions.
May 2023
Expected to increase trade flows between the two regions with a projected growth of 8% in bilateral trade by 2025.